MANUFACTURING

Experienced with vast applications based on Thick Film Substrates
Printed conductors and resistors on Alumina, Aluminum Nitride
or Berillia substrates which provide excellent heat dissipation, high
accurate resistors trimming (passive or active), minimal
moisture absorption, high reliability and reduced size.

Components
All kind of component packages can be assembled on those
substrates: Standard SMT, fine pitch SMT, Flip-Chips,
bare die chips, etc.
Capabilities
SMT Components: 0402
Fine Pitch: 0.015’’ Pitch
Interconnections
Interconnection technologies include: Reflow soldering,
C&W (ball or wedge, Aluminum or Gold), Thru-Hole, by selective soldering
Capabilities
Gold Bonding – Thermosonic 0.0007″ to 0.002″ diameter
Aluminum Bonding – Ultrasonic 0.0007″ to 0.020″ diameter

Product Assembly Testing:

Taditel’s products are validated according to rigorous internal validation levels and also according to our customer’s requirements:

  • End Of Line Testing
  • Performance testing.
  • Thermal Shock Thermal Cycling
  • High Temperature Endurance
  • Autoclave / Salt fog

Automotive Assembly Capabilities

  • High accurate Components trimming passive or active
  • SMT Components: down to 0402 size
  • Accurate Trough-hole placement
  • Fine Pitch: down to 0.015’’ Pitch

Interconnections

Interconnection technologies include:

  • Reflow soldering
  • Thru-Hole soldering
  • Selective soldering
  • Resistance welding
  • Ultrasonic welding

Product Manufacturing

  • Production capacity in a wide range of technologies and flexible quantities
  • Process quality and product without compromise
  • A global supply chain that relies on leading global manufacturers
  • A circle of quality sub-suppliers qualified per automotive industry
  • Reliable logistics system

Experienced with vast applications based on Thick Film Substrates
Printed conductors and resistors on Alumina, Aluminum Nitride or Berillia substrates which provide excellent heat dissipation, high accurate resistors trimming (passive or active), minimal moisture absorption, high reliability and reduced size.

Components
All kind of component packages can be assembled on those substrates: Standard SMT, fine pitch SMT, Flip-Chips, bare die chips, etc.