TECHNOLOGIES

Experienced with vast applications based on Thick Film Substrates
Printed conductors and resistors on Alumina, Aluminum Nitride or Berillia substrates which provide excellent heat dissipation, high accurate resistors trimming (passive or active), minimal moisture absorption, high reliability and reduced size.

Components
All kind of component packages can be assembled on those substrates: Standard SMT, fine pitch SMT, Flip-Chips, bare die chips, etc.

Capabilities
SMT Components: 0402
Fine Pitch: 0.015’’ Pitch

Interconnections
Interconnection technologies include: Reflow soldering, C&W (ball or wedge, Aluminum or Gold), Thru-Hole, by selective soldering

Capabilities
Gold Bonding – Thermosonic 0.0007″ to 0.002″ diameter
Aluminum Bonding – Ultrasonic 0.0007″ to 0.020″ diameter

Experienced with vast applications based on Thick Film Substrates
Printed conductors and resistors on Alumina, Aluminum Nitride
or Berillia substrates which provide excellent heat dissipation, high
accurate resistors trimming (passive or active), minimal
moisture absorption, high reliability and reduced size.

Components
All kind of component packages can be assembled on those
substrates: Standard SMT, fine pitch SMT, Flip-Chips,
bare die chips, etc.
Capabilities
SMT Components: 0402
Fine Pitch: 0.015’’ Pitch
Interconnections
Interconnection technologies include: Reflow soldering,
C&W (ball or wedge, Aluminum or Gold), Thru-Hole, by selective soldering
Capabilities
Gold Bonding – Thermosonic 0.0007″ to 0.002″ diameter
Aluminum Bonding – Ultrasonic 0.0007″ to 0.020″ diameter